Committees

Marco Deluca (Silicon Austria Labs, Austria)

Lutz Ende (X-FAB Silicon Foundries GmbH, Germany)

Silke Hamm (Mattson Thermal Products GmbH, Germany)

Volker Häublein (Fraunhofer IISB, Germany)

Katharina Hoch (TDK-Micronas GmbH, Germany)

Wilfried Lerch (Fraunhofer EMFT, Germany)

Alexander Scheit (Fraunhofer IPMS, Germany)

Temel Buyuklimanli (Evans Analytical Group, EAG Laboratories, USA)

Chris Chern (AIBT, Taiwan)

Ray Duffy (University Tyndall, Ireland)

Ignaz Eisele (Fraunhofer EMFT, Germany)

Stephanie Glinsner (Infineon Technologies Austria AG, Austria)

Silke Hamm (Mattson Thermal Products GmbH, Germany)

David Hendrix (Skywater, USA)

Katharina Hoch (TDK-Micronas GmbH, Germany)

Anna Johnsson (Synopsys GmbH, Germany)

Sebastien Kerdiles (CEA-Leti, France)

Fareen Khaja (Veeco, USA)

Jan Krügener (Universität Hannover, Germany)

Gerhard Kunkel (Hitachi Energy Switzerland Ltd, Switzerland)

Takashi Kuroi (Nissin, Japan)

Didier Landru (SOITEC, France)

Sham Sagaria Marisinapen (Infineon Technologies , Malaysia)

Frédéric Mazen (CEA-Leti, France)

Fulvio Mazzamuto (Axcelis, USA)

Akira Mineji (SMIT, Japan)

Jürgen Niess (HQ-Dielectrics GmbH, Germany)

Xavier Pagès (Levitech BV, the Netherlands)

Lars Rebohle (HZDR – Helmholtz-Zentrum Dresden-Rossendorf, Germany)

Nicole Sacher (Centrotherm international AG, Germany)

Ashutosh Sagar (Intel, USA)

Felix Spengler (Bosch, Germany)

Karl-Heinz Stegemann (X-FAB Silicon Foundries GmbH , Germany)

Louis Thuries (Screen Lasse, France)

Frank Torregrosa (Ion Beam Services S.A.S., France)

Daniel Valtiner (Infineon Technologies Austria AG, Austria)

Anabela Veloso (IMEC, Belgien)

Hitoshi Wakabayashi (Tokyo Institute of Technology, Japan)

Shengqiang Zhou (HZDR – Helmholtz-Zentrum Dresden-Rossendorf , Germany)

Wei Zou (Applied Materials, USA)

Jeff Boeker (Kingstone semiconductor Corp., China)

David Chen (Advanced Ion Beam Technology, Inc., Taiwan)

Paul Chu (City University of Hong Kong, Hong Kong)

Michael Current (Current Scientific, USA)

Susan Felch (Susan Felch Consulting, USA)

Nariaki Hamamoto (Nissin Ion Equipment Co., Ltd.)

Silke Hamm (Mattson Thermal Products GmbH, Germany)

Volker Häublein (Fraunhofer IISB, Germany)

Amitabh Jain (MicroSol Technologies Inc., USA)

Masataka Kase (Socionext Inc., Japan)

Yoji Kawasaki (Sumitomo Heavy Industries Ion Technology Co., Ltd., Japan)

Fareen Khaja (Vecco Inc., USA)

Didier Landru (SOITEC, France)

Larry Larson (Texas State University, USA)

Wen-Hsi Lee (National Cheng Kung University, Taiwan)

Wilfried Lerch (Skylark Solutions, Germany)

Jiro Matsuo (Kyoto University, Japan)

Dirk Mous (High Voltage Engineering Europa BV, Netherlands)

Lourdes Pelaz (University of Valladolid, Spain)

Deven Raj (Applied Materials Inc., USA)

Leonard Rubin (Axcelis Technologies Inc., USA)

Heiner Ryssel (Fraunhofer IISB, Germany)

Werner Schustereder (Infineon Technologies AG, Austria)

Mikio Takai (Osaka University (emeritus), Japan)

Aaron Vanderpool (Intel Corp., USA)