Scope of Conference Topics

Advanced Equipment for Ion Implantation, Annealing, and Metrology

Tools for beam line ion implantation, plasma doping, cluster, and molecular ion beams
Equipment for thermal and a-thermal annealing (laser, microwave, flash, neutral beams, etc.)
New material solutions and techniques for equipment technology
Metrology equipment for implantation control (particles, contamination, charging, etc.) and for implanted layers (implant profiling, sheet resistance, etc.)
Non-mainstream ion implantation / annealing methods (using plasma, high energy ions, atomic clusters, ion beam mixing, etc.)
Advanced process control (tool software assisted, fab solutions, “tool health factors”, digital twin)
Leveraging AI and machine learning for equipment and process optimization

Ion implantation and annealing of Si, Ge, SiC, GaN and other III-V semiconductors, graphene, exotic materials
Advanced junction formation by special annealing techniques
Surface modification by annealing techniques and ion implantation
New doping techniques: monolayer doping, atomic layer deposition, selective CVD/epi, MOCVD, laser-assisted doping, thermal and recoil mixing methods
Layer transfer for heterogeneous materials integration, 3D IC stacking
Comparison of different annealing techniques

Power and RF devices (Si, Ge, SiC, GaN, etc.)
Large area devices (displays, solar cells, wearables, etc.)
LEDs, MEMS, image sensors, chemical and physical sensors
Planar and non-planar, emerging CMOS (FinFETs, nanowires, etc.), 3D memories
Junction contact and metal gate work function engineering
Photonic devices: CMOS-photonic integration, materials for multi-dimensional photonic signal processing and transmission, vertical-cavity surface-emitting lasers
Nano-scale device fabrication for quantum confined films, wires and dots, quantum information processing
Metrology methods: elemental, electrical, and morphological analysis of 3D devices, junctions, strain, interfaces and contacts
New materials for devices

Defect generation due to ion irradiation in substrates and its annealing
Sputtering and surface modification due to ion bombardment and strategies for defect mitigation
Ion beam assisted methods for near-surface material analysis (SIMS, RBS, etc.)
New metrological technologies for characterization of implanted and/or annealed surfaces / devices